Originally Posted by Aussiejuggalo
How much further can we shrink nodes on nm before we're stuck and need to look at other options?
The industry is already looking at other options, it's just that they are not mature enough yet. 3D die stacking is only viable for ram right now, but that might be how we can squeeze out another few generations. Progress are a bunch of S curves, we're at the end of the silicon S curve, it'll probably be some new tech like photonics or quantum computing that'll be the next big leap.