Originally Posted by GHADthc
I just want to see a direct die block for Zen 2...
It won't make that big of a difference using "direct die" cooling. I've been doing this for years now..... since sA (462 pin) processors.... oh wait those didn't have IHS plates on them.
This here is nothing new to me personally, but for most of you.... that could be different.
So first we have to understand WHY they use heat spreaders. This is a must to understand it's cause and then removal effects.
OK so you have a plate. it's X size in mass. It absorbs X amount of heat until dissipated by a cooling block or fan.... or maybe even passively if say using a 15W chip like a NB chipset for example. Which.... are direct die cooled.
Now you remove that plate, you decrease the amount of Mass that retains X heat.
The more copper you have, the longer it takes to heat up and also the longer it takes to dissipate that heat.... And that's where the removal of that plate idea comes into play.
__Create heat faster... remove heat faster. That is the name of the game with direct die cooling.
Intel chips, remove plate, replace stock TIM with something better, put plate back on and drop significant temps. Remove the plate, which will hold and retain heat, helps to dissipate to the cooler faster. But from this, it takes less time to achieve X heat load temps.
That was the quick run through there.
So many of you have been direct die cooling for years and years and didn't even know it. Every motherboard uses direct die cooling. All chipsets are "direct die" cooling.
5-15w chips direct die cooling and passive in most cases.
IMO - which really may not matter to most people, is this "new cooler" or "new cooling type" is nothing special. This type of cooling won't matter with AMD Ryzen processors (any). Your gains will be minimal at best.
The A.I overclocking is generally more efficient than manual (static) overclocking. So doing all this "direct die" cooling, isn't really going to make end results good enough to spend the time and moneys on this adventure. Phenom II, FX chips actually benefit pretty well from this type of cooling however. Ryzen chips, at least what I've experienced Direct die cooling (on several chips) made absolutely no difference to have wasted my time doing so.
1331 Lid-less PGA 2700X - On a stock air cooler.
4.1Ghz 1.212-1.225v (extreme Digi-VRM) static overclock = best efficiency.