[Hexus] JetCool CPU Waterblocks 10x Better at Heat Transfer - Page 2 - Overclock.net - An Overclocking Community

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[Hexus] JetCool CPU Waterblocks 10x Better at Heat Transfer

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post #11 of 43 (permalink) Old 07-11-2019, 02:30 PM
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I remember a GamersNexus video from a few months ago talking about someone in the UK making direct die water cooling blocks, with an o-ring that seals against the top of the CPU's PCB. They were for the high speed trading industry and their overclocked servers that are in the same room as the trading servers. I cannot find it now though.

I really want one!
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post #12 of 43 (permalink) Old 07-11-2019, 03:03 PM
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Isn't heat transfer coefficient usually expressed in Kelvin?


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post #13 of 43 (permalink) Old 07-11-2019, 03:12 PM
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Quote: Originally Posted by Asmodian View Post
I remember a GamersNexus video from a few months ago talking about someone in the UK making direct die water cooling blocks, with an o-ring that seals against the top of the CPU's PCB. They were for the high speed trading industry and their overclocked servers that are in the same room as the trading servers. I cannot find it now though.

I really want one!

Don't think I saw that video. LTT did a video about a direct die water block but they didn't really do much with it (being LTT).


only dropped 2c going direct die (granted with thermal paste) over delided and re-lidded with liquid metal though.

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post #14 of 43 (permalink) Old 07-11-2019, 03:17 PM
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Quote: Originally Posted by The Pook View Post
only dropped 2c going direct die (granted with thermal paste) over delided and re-lidded with liquid metal though.
Direct die with a water block is very different from direct water on the die though, it would be very interesting to see how much better it can get in practice.
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post #15 of 43 (permalink) Old 07-11-2019, 03:23 PM
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I just had a stupid idea.

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post #16 of 43 (permalink) Old 07-11-2019, 03:34 PM
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Quote: Originally Posted by GHADthc View Post
I just want to see a direct die block for Zen 2...
It won't make that big of a difference using "direct die" cooling. I've been doing this for years now..... since sA (462 pin) processors.... oh wait those didn't have IHS plates on them.

This here is nothing new to me personally, but for most of you.... that could be different.

So first we have to understand WHY they use heat spreaders. This is a must to understand it's cause and then removal effects.

OK so you have a plate. it's X size in mass. It absorbs X amount of heat until dissipated by a cooling block or fan.... or maybe even passively if say using a 15W chip like a NB chipset for example. Which.... are direct die cooled.
Now you remove that plate, you decrease the amount of Mass that retains X heat.
The more copper you have, the longer it takes to heat up and also the longer it takes to dissipate that heat.... And that's where the removal of that plate idea comes into play.
__Create heat faster... remove heat faster. That is the name of the game with direct die cooling.
Intel chips, remove plate, replace stock TIM with something better, put plate back on and drop significant temps. Remove the plate, which will hold and retain heat, helps to dissipate to the cooler faster. But from this, it takes less time to achieve X heat load temps.
That was the quick run through there.

BUT WAIT!!!!!
So many of you have been direct die cooling for years and years and didn't even know it. Every motherboard uses direct die cooling. All chipsets are "direct die" cooling.

5-15w chips direct die cooling and passive in most cases.

IMO - which really may not matter to most people, is this "new cooler" or "new cooling type" is nothing special. This type of cooling won't matter with AMD Ryzen processors (any). Your gains will be minimal at best.
The A.I overclocking is generally more efficient than manual (static) overclocking. So doing all this "direct die" cooling, isn't really going to make end results good enough to spend the time and moneys on this adventure. Phenom II, FX chips actually benefit pretty well from this type of cooling however. Ryzen chips, at least what I've experienced Direct die cooling (on several chips) made absolutely no difference to have wasted my time doing so.

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post #17 of 43 (permalink) Old 07-11-2019, 06:55 PM
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Quote: Originally Posted by Asmodian View Post
Direct die with a water block is very different from direct water on the die though, it would be very interesting to see how much better it can get in practice.
I almost wonder if their claimed cooling advantages is largely due to this instead of some fancy water spraying. As it is, we don't have any "water immersion blocks" on the market to test this theory.

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post #18 of 43 (permalink) Old 07-11-2019, 07:58 PM
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Quote: Originally Posted by GHADthc View Post
I just want to see a direct die block for Zen 2...
not much improvement when swapping the solder with LM




so around 5-8c max improvement on direct die waterblock, maybe

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post #19 of 43 (permalink) Old 07-11-2019, 09:48 PM
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Quote: Originally Posted by looniam View Post
look at the thermal resistance legends on the sides:

typical set up:
die|package(tim/solder)|IHS(cu)|tim|heatsink|fluid

their solution/concept:
die|fluid

it looks to "squirt" cooling fluid directly on the die.
(incoming squirting jokes YO!)

this, from what i see in the article and that image, is for system integrators. since dies are not all the same sizes its going to be "one use/product" cases.
Looking at your avatar, you had the idea before them

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post #20 of 43 (permalink) Old 07-11-2019, 11:31 PM
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Quote: Originally Posted by The Pook View Post
Don't think I saw that video. LTT did a video about a direct die water block but they didn't really do much with it (being LTT).

https://www.youtube.com/watch?v=n4O_Dq3xRJA

only dropped 2c going direct die (granted with thermal paste) over delided and re-lidded with liquid metal though.
Every block is direct die if you're crafty enough.
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