Originally Posted by d0mini
As with CPUs, smaller GPU modules are going to help with yields. If you make 1 600mm2 monolithic die which turns out faulty, you can't use it at all. If you make 4 150mm2 modular dies that take up the same wafer space and one fails, you still have three useable dies.
You can burn damaged parts by laser, and make chip to allow full functionality after laser removes the more damaged pathway. With proper automation and volume, the additional step is fairly cheap.
When chip is designed to allow slicing to multiple smaller functional chips, even one massive damage in upper right corner, still allows for one mid end chip, and one low end chip. Or three low end chips.
There are multiple ways how to reduce problems with yields of large chips. Some of them are simple like: Lets assume 2080 Ti has yield of 5/100, however sales figures shows that only <3/100 of sold graphic card are using 2080 or 2080 Ti. Cutting 95/100 that didn't make it into smaller dies would allow for both getting enough 2080 + 2080 Ti cards AND meeting demands for cheaper cards.
Yields are typically decent enough for NVidia to sell 1200$ cards without needing to do some shenanigans. (Then again, Jensen leather coats are expensive, and NVidia likes its profit.)