(Second razor helped for the final part getting apart the IHS)
Voltage is 1.275 in BIOS (Asrock Z77E-UTX), no offset, but CPU-Z shows 1.296V.
So I guess I am far from a golden chip.
Before:Warning: Spoiler! (Click to show)
Die contact: good enough, no need for lapping the inner side of the IHS:
Lapping (wet): from 600, 800, 1200, 2000, to 3000 sand paper grain size:
Mirror effect is here, little blurred area on the low right (see my avatar) but it will do!
IHS/NH-C14 contact after lapping:
Not as perfect as would have liked, was expecting a nice red square but I will live with it. Don't want to lap the base of the Nh-C14...
I then used the little brush that comes with CLU for both applying CLP and CLU.
It leaves some traces as you can see, so I guess it works but is not the perfect tool.
CLP on the die (and inner IHS):
CLU ont he IHS (and NH-C14):
After delidding and lapping:
Before and after ambient T° were almost identical, maybe a little warmer for the 2nd test (~19°C).
Min temps are colder on the 2nd test because I run the it at the first boot, while last time I did several tests/reboots before making the screenshot.
Core #2 is still the hottest, but max temp droped down from 98°C to 60°C: minus 38°C!!! IMPRESSIVE!!!
Core #1 is still the coolest, max temp droped down from 86°C to 52°C. So the max diff between core #1 and #2 is reduced from 12°C to 8°C. Was expecting a better result here, like a 3-4°C diff. I am using the iGPU, dunno... What do you guys think?
I did all the job on a wood table without being grounded, touching a metallic heater from time to time though.
Those antistatic bracelets looks so short I didn't want to be bothered wearing one (plus I had to wait 1 week to get one)
For those using one, where do you attached it?
Unlike many other hunting for speed, I am happy with 4.5GHz and did delid to reduce temps and be able to run the cooler at 9v or even 7V for extra silence.
Will see if I still have room for some extra GHz and staying silent though