If you remember This Thread, I delid a 3770K processor and confirmed that Intel screwed it's loyal customers by crippling Ivy Bridge line of processors. This resulted in overclockers having to swap the "internal" thermal paste (the TIM between the CPU Die and the integrated heat spreader) to get the best out of those chips.
It looks like Intel completely ignored the overclocking community's outrage and decided to pull the exact same move with Haswell. I'll be investigating to see if that is in fact the case here.
I Ordered a 4770K and an Asus Gryphon board for this test. They got shipped today and I should have them within the next day or two. Stay tuned.
List of parts that I used for this test:
Asus Z87 Gryphon
Core i7 4770K
8 GB Corsair 1333 MHz (Dual Channel)
Antec Kuhler 920 (Push/Pull with stock fans at maximum RPM)
Cool Laboratory Liquid Pro + Xigmatek Freezing Point G4718
Stress testing was done by Prime95 64-bit version 27.9 on custom settings with FFT length set to 32 (Run FFTs in-Place checked). Duration: 10 minutes. CPU voltage and frequency were set to 1.312 volts and 4.3 GHz respectively.
Average CPU Load temperature: 87.5
After delid (Cool Laboratory Liquid Pro between Die and IHS):
Average CPU Load temperature: 69
As you can see, With a "simple" thermal grease swap, the temperatures droped by an average of 18.2 C while using 1.312 volts.
Waiting for Ivy Bridge-E now. let's see if the trend continues.
I have used nearly every CPU from Sandy Bridge on and Phenom II on. I have also used most GPU's from 2011 on, from low, mid and high. I've built 100's of rigs over the years. Most for fun and some for side work. If you have any questions and want an unbiased opinion, please feel free to PM me.