Don't fight guys, I value all your advice in this thread. I will be putting LM on both sides, because I will be adding gaulk on corners, so I don't want to risk that 1-2mm gap to interfere with cooling.
I think you both are right, just some people don't seal the cpu, so that makes a difference, as black gaulk adds about 1-3 mm of spacing in between. Application also matters, how much you keep the cpu in pressed position, and how much glue agent is applied.
I saw Gamer's Nexus put gaulk, but he would ALWAYS put LM on both sides, then he said that thermals are affected by the gaulk and started putting a tiny bit on corners, then he said forget the gaulk and would just stick the CPU into the socket, and use bracket to stick it there.
In my case I want a cpu that I can safely remove without worry, so gaulk it is, and I will be putting LM on both sides for reason I wrote above.
On the side note: Went back to 1.26 volts on air, and it's stable after running in Aida64 with Geminii S524 cooler (thermally and stability wise)
Looking forward to delidding, it will give a nice temp drop. I am not even sure I will go back to water now. Because temps look phenomenal for my set up
Never thought I will be debating between air and water again. I have H115i Pro coming in mail from Corsair, but now I don't know if I need it.
Going to check the sound of that pump, and see if it's silent, with no buzzing like H105/H100i
I can make this computer completely silent now, as I have fan controllers on the back of the case to reduce sound completely. I can hear my refrigerator more in the kitchen from my room, than PC in my room.