Originally Posted by Papazmurf
I used to swear by the dot and/or line method. However on these HEDT chips, I was really struggling to get even core spread with thermals. I now spread the TIM with a plastic card on every mount as it gives me the most consistent results.
Also, the instructions in the Kyronaut package say to spread. Why bother putting a how to and not mention other methods, unless Thermal Grizzly thinks it's that much better of a process. That was my logic anyways, and anecdotally it has held true. It's more of a pain in the ass to get a good spread than putting a dot or line, but imo it's worth it for every mount.
With Kryonaut peeps might want to try spreading it thinly with non-powdered surgical gloves, tighten block, run RealBench a few minutes, heat the TIM up, shut down immediately, loosen the screws on the block until you can just move it without losing contact, slide it around in every direction 30 seconds, tighten screws again, TIM on entire CPU IHS.
I did that on my 3950X except I also put a small drop of Kryonaut over each of the three chiplet areas.
At LLC3, 1.2625v CPU, 1.45v RAM, .1.1125 VOC, .950 VDDG's and .900v VDDP, with one 360 RAD and an Optimus Foundation CPU block, I hover around 60C while looping Cinebench