With little to know cooling on my memory it can easily rise above my TJ ocing. non XT. I watched my TJ in real time while adjusting the pressure on my waterblock. It you can see it move up and down with even and uneven pressure on the die. Perhaps the surrounding area is affected as well. I also have no backplate, though it's probably not a good idea, I actually touch the back of the card and feel the heat on the other side of the water block. When the heat is spread out around the die, the tj falls. Pretty handy little reading. The memory seems to have little to no impact on the TJ. GPU-Z. Any evoke user could probably tell you that ^^
Sapphire Radeon RX 5700 Non XT Boost Core 2035 Gaming Ram 960 43c Air Water Hybrid Cardboard Blower with a 20$ chinese Waterblock on the core 50 gallon tote of water, Ryzen 3700x 4.25 ghz, 15$ chinese waterblock, same tote 3200 ddr3 cl16 Team T-FORCE VULCAN TUF , B450m Asrock Pro 4 Mobo, 700 Watt OCZ PSU.