Sorry to resurrect this thread..
I'm going to be de-lidding my 8700k and was wondering if the silicon referenced in this thread is permanent once cured, or if it can be removed again with the delid die mate in the event that a re-application of liquid metal is needed. Also, since it seems the liquid electrical tape is recommended to cover exposed components on the PCB under the IHS, would it also be strong enough to hold the IHS down if applied around the edges?
I'd feel more comfortable if the IHS were re-attached some way, however it would seem like it would be a bad move to use a method that was permanent..?
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