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-   -   EK Supremecy Evo Poor Contact With CPU? (https://www.overclock.net/forum/61-water-cooling/1724776-ek-supremecy-evo-poor-contact-cpu.html)

BradleyW 04-22-2019 06:28 PM

EK Supremecy Evo Poor Contact With CPU?
 
2 Attachment(s)
The contact doesn't seem right to me. No paste on the right side. The CPU I'm mounting it on is the 9900K.

Should I attempt to lap the surface? (Never lapped before).

The mounting pins also look like they are pointing off in different directions, unless it is trick of the eye?

Surface of the CPU block has lots of light swirl marks under a strong light.

See images, thank you.

ThrashZone 04-22-2019 08:01 PM

Hi,
Might want to spin test the cpu it might have a hump on it.

You might also try the ek evo with the thinnest razor blade jet plate or without one period might give it more flex to get around the chips hump.

Vlada011 04-23-2019 01:06 AM

It's not to bad.

Pinnacle Fit 04-23-2019 07:50 AM

You can try lapping, but try first using a ‘goofy’ orientation ‘90 degree’ orientation of the block. Xtremerigs https://www.xtremerigs.net/2014/08/2...on-definition/

https://www.xtremerigs.net/2018/10/1...intel-and-amd/
https://uploads.tapatalk-cdn.com/201...7ae74aba81.jpg


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ThrashZone 04-23-2019 09:12 AM

Hi,
Unlike 7900x or probably 9900x the 9900k is more vertical than horizontal die so the evo would probably perform better in the default or upside down position which ever pipes better
Horizontal/ goofy worked pretty good on a 7900x though.

Pinnacle Fit 04-23-2019 09:21 AM

Quote:

Originally Posted by ThrashZone (Post 27942862)
Hi,

Unlike 7900x or probably 9900x the 9900k is more vertical than horizontal die so the evo would probably perform better in the default or upside down position which ever pipes better

Horizontal/ goofy worked pretty good on a 7900x though.


They said that regular or upside down was identical.

But now that I think of it...if the TIM worked as intended, there should be an even distributed conduction of heat from die to IHS, so the orientation of the block should theoretically be irrelevant.

I have to reread the article but it would stand to reason that a delidded cpu using liquid metal between die and ihs should have near 100% heat conduction, so the block orientation shouldn’t be relevant.

Maybe I’m assuming too much.


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skupples 04-23-2019 10:56 AM

the swirls definitely don't matter.

n if you're gonna mess with lapping, you might as well just get a delid kit + pre-lapped all copper IHS.

Pinnacle Fit 04-23-2019 04:36 PM

Quote:

Originally Posted by skupples (Post 27942956)
the swirls definitely don't matter.



n if you're gonna mess with lapping, you might as well just get a delid kit + pre-lapped all copper IHS.



This


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ThrashZone 04-23-2019 07:27 PM

Quote:

Originally Posted by Pinnacle Fit (Post 27942872)
They said that regular or upside down was identical.

But now that I think of it...if the TIM worked as intended, there should be an even distributed conduction of heat from die to IHS, so the orientation of the block should theoretically be irrelevant.

I have to reread the article but it would stand to reason that a delidded cpu using liquid metal between die and ihs should have near 100% heat conduction, so the block orientation shouldn’t be relevant.

Maybe I’m assuming too much.


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Hi,
Problem might be op doesn't want to delid his 9900k soldered chip :)

Pinnacle Fit 04-23-2019 07:42 PM

Quote:

Originally Posted by ThrashZone (Post 27943514)
Hi,

Problem might be op doesn't want to delid his 9900k soldered chip :)



Then I misread it...I thought he said 7700k rather than 9900k. It can still be done but it doesn’t yield much benefit to delid a chip that’s already got STIM, so good call on OP not deluding it.


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