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-   -   [Hexus] JetCool CPU Waterblocks 10x Better at Heat Transfer (https://www.overclock.net/forum/349-technology-science-news/1729188-hexus-jetcool-cpu-waterblocks-10x-better-heat-transfer.html)

mouacyk 07-11-2019 09:39 AM

[Hexus] JetCool CPU Waterblocks 10x Better at Heat Transfer
 
Source: https://hexus.net/tech/news/cooling/...er-processors/

As dies get smaller, the heat density and intensity increases, but flow rate of water loops don't (and can't) keep up with the needed heat transfer in common micro-fin/channel designs. But what if you focus a high flow rate at just the impingement zone, in arrays of jets that are less than 1mm each? In effect, this increases the temperature difference potential significantly where it matters, because cool water is presented in a higher volume, and more heat is taken away in the same unit of time (heat transfer).

ToTheSun! 07-11-2019 10:23 AM

Intel wants to know your location.

GHADthc 07-11-2019 10:32 AM

I just want to see a direct die block for Zen 2...

airisom2 07-11-2019 10:44 AM

Sounds very similar to 8pack's product showcase at computex 2019.

bigjdubb 07-11-2019 01:29 PM

Quote:

Another key feature of JetCool cooling is that the cooling fluid isn't passed over a surface like a heatsink or cold plate but instead "aimed directly at the surface".
Surely they don't mean directly at the surface of an IHS. So directly at the surface of what? I can't imagine it being anything other than a cold plate if they intend for the water it's spraying to be contained.


I think I figured out the diagram. They are talking about the direction the fluid is traveling, perpendicular to the IHS instead of parallel. This seems like it would require considerable pumping power.

mouacyk 07-11-2019 01:44 PM

Quote:

Originally Posted by bigjdubb (Post 28037896)
Surely they don't mean directly at the surface of an IHS. So directly at the surface of what? I can't imagine it being anything other than a cold plate if they intend for the water it's spraying to be contained.

Pretty sure it sounds like they are intending to do direct-die jetting (whole new meaning to direct-die cooling ;). There has to be a pressure level that can deliver the performance of 10x common passive techniques, but still safe enough to not chip at the die over continuous usage. If that is too dangerous and complicated with mating issues to the rest of the PCB, they can still apply a thin but robust shim/plate to the die to act as a buffer but still draw heat efficiently.

bigjdubb 07-11-2019 01:47 PM

That makes sense but I'm not sure anyone would consider something like that to be a consumer solution.

EniGma1987 07-11-2019 01:52 PM

https://hexus.net/media/uploaded/201...2a8c7fdf8b.jpg






Looks like they are showing their block with no bottom and mounted directly against the IHS as the bottom of the unit (the brown piece is the IHS?)?
Or is the IHS supposed to be the turquoise color piece and the bottom of this is the brown piece?

bigjdubb 07-11-2019 02:03 PM

Yeah, I couldn't figure out that part of it. I think the main point of the diagram (besides confusing people so they don't question it) is to show that "traditional" cooling moves the water across the cold plate instead of hitting it head on.

looniam 07-11-2019 02:11 PM

Quote:

Originally Posted by EniGma1987 (Post 28037938)
https://hexus.net/media/uploaded/201...2a8c7fdf8b.jpg






Looks like they are showing their block with no bottom and mounted directly against the IHS as the bottom of the unit (the brown piece is the IHS?)?
Or is the IHS supposed to be the turquoise color piece and the bottom of this is the brown piece?

Quote:

Another key feature of JetCool cooling is that the cooling fluid isn't passed over a surface like a heatsink or cold plate but instead "aimed directly at the surface". Check out the diagram below to see the tech comparison between traditional and JetCool cooling.
look at the thermal resistance legends on the sides:

typical set up:
die|package(tim/solder)|IHS(cu)|tim|heatsink|fluid

their solution/concept:
die|fluid

it looks to "squirt" cooling fluid directly on the die.
(incoming squirting jokes YO!)

this, from what i see in the article and that image, is for system integrators. since dies are not all the same sizes its going to be "one use/product" cases.


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