I think you might have inferred an answer, but didn't really answer. Is it worth it to delid? Yes, probably. Has the TIM been improved? No, not really (not soldered, all accounts are same material as on the 8700K.)It is just a binned 8700K. Nothing special about it aside from being clocked slightly higher. The 5GHz is for 1 core. I run my 8700K at 5GHz all cores and am in the 60's to low 70's while gaming with a 240mm AIO. Noise mostly comes from my 1080 ti.
It is the same but the paste had to have been different on the 7700k, actually sure it was stated. The 7700k will hit 90C even on an EK loop when trying to get a good OC out of them. I have built many systems on air with them without an OC and they hit 80s on a stress test but coffee lake is actually cooler than its less core count 7700k.Coffee Lake is Kaby Lake with more cores. It's the same architecture. Everyone's experience with thermals out of the box will be different. If your IHS makes poor contact with the die, you will have to delid if you want to overclock. That's why I insist on waiting because delidding might not be needed.
Try having both CPU's delidded and the pastes used compared between each one precisely. Only then can it be clear if there were differences in the paste used, or the quality of the manufacturing improved or not.There's imperfections in the manufacturing process. Your mileage may vary. Not sure how else to say it.
Be professional about it. I just went to buy insurance... It's not listed. https://click.intel.com/tuningplan/purchase-a-planIll get a 8086k this week sometime. Gonna delid it and see how high it can go
What is it you are saying here about gaps after delidding? What gap is larger?Whether or not a better paste is used doesn't matter if there's a larger gap between the die and IHS. Once you delid the processor, the manufacturing process doesn't matter anymore.
I'm beginning to think you have a reading comprehension problem. I didn't say anything about the gap after delidding, but the gap should be less after delidding. If the gap is larger after delidding, you're doing it wrong. If the gap is satisfactory out of the box, there's no need to delid.What is it you are saying here about gaps after delidding? What gap is larger?
Quoting you again "Whether or not a better paste is used doesn't matter if there's a larger gap between the die and IHS."I'm beginning to think you have a reading comprehension problem. I didn't say anything about the gap after delidding, but the gap should be less after delidding. If the gap is larger after delidding, you're doing it wrong. If the gap is satisfactory out of the box, there's no need to delid.
You have to build a decent loop to get lower temps than air.I've made a couple of videos which should help you.
The first explains the 8086K compared to the 8700K in terms of specs and manufacturing process....
The second show my results before and after delidding my 8700K (expect similar from an 8086K as its the same physical chip as the 8700K with the same thermal material).....
Based on my experience and the facts regarding 8086K, the chip on average appears to be reaching good clock speeds at relatively low voltages (think 5GHz on all cores at around 1.2Vcore).
Delidding could be the difference between being able to run your fans at a lower speed or not, but on air I wouldn't expect a significantly greater overclock as a result of delidding. On water it's a different story. Without delidding on water, you'll hit thermal limits before voltage limits.
My advice is run the chip without delidding first, see what it can do and if you're happy with the thermals, and make a decision from there.
I have another video showing how to delid if you decide to go down that path. It's a very easy process if you take your time....
I hope this helps /forum/images/smilies/smile.gif