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Discussion Starter #1
I am going to do a little project to see if I can get a little better air cooling for my Opteron 165, which for some reason runs rather hot even at stock settings (possible bad TIM placement under IHS?). I am going to replace my Arctic Freezer pro 64 with the stock PIB HSF cooler that came with it but I am going to do a couple of things first. I am going to lap the HSF (not the IHS, as I have a 3 year warranty with the retail opty I got) and then switch out the 80mm fan with a high flow vantec tornado 80mm.
My question is this which way should I do the airflow, down towards the cpu or sucking from the bottom of the mobo into the case. I already have a 92mm Tornado setup in the back of the case air out and have a modular PSU and tidied up internal cabling, a dual slot PCI fan on the bottom and a dual 40mm hard drive cooler. Also an ArcticSilencer 5.2 on my x800 GTO. Even though it is a mATX case, it is almost mid size and should have decent airflow. When my Sandy was in the case highest load temp was like 36c so I know its not the case and after repeated attempts at reseating, switching from the stock cooler and using the recommended rice size amount of AS5 my 165 idles in the range of 38c/40c and dual priming hits as high as 55c load depending on the ambient temp.

I am going to order a premium lapping kit from easypckits and follow the FAQ on lapping here so i should be fine in that area my goal is to at least get a five degree drop from this and maybe switch out the 92mm tornado for a regular 92mm fan. The noise is a little bad but not to bad for where my PC is at but i figure since I didn't see any improvement adding the Tornado to the back of the case i might try seeing if the higher cfm fan will improve cooling as the stock AMD HSF is said not to be so bad, being copper based and 4 heat pipe version.
 

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My only suggestion is to lap the IHS... it sounds like it's concave or convex.
 

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Id just return it and hope for a better chip -- or take off that pesky IHS (or maybe just lap it is stated before, its probably super-concave leading to terrible heat transfer)
 

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In most cases from what I have seen you can get a 2 to 3 C drop in temps from lapping a heatsink. It takes some time. For the fan on the haetsink put are iiinto the heatsink. You want to get the heat away from the fins or out of the fins. They pull the heat up and by cooling them you get lower temps. So make sure you use AS5, Just a BB size will do the job you are looking for
 

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Discussion Starter #5
thanks for the replies, Lone136 your saying blowing down into the fins is what I want? And if I see only a couple degree difference I will go ahead with the IHS lapping maybe even removal. If i remove it I will want to put it back on it so which TIM is best for under the IHS? still AS5?
 

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The airflow is pointed downwards into the fins. This ensures that all of the airflow flows freely and swiftly through the fins. If the airflow were pointed upwards into the case, the air wouldn't flow as swiftly through the fins. A lot of people are putting AS5 under the IHS as well as on top.
 

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Hey, AS5 under the IHS as well as on top is a good idea if you dont want to risk damaging the CPU when installing a HUGE cooler (like the BT or tuniq tower or scythe mine) and I bet you could still RMA it if you glued it neatly, they probably would never notice unless they cracked it open XD
 
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