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Discussion Starter #1
Hi guys. I'm trying to apply the AS5 thermal paste for the first time. I got the surface cleaned from the old thermal and ready to apply the new one.<br><br>
I know that I should put a dot of the paste in the center of the heat spreader, then put the heatsink on top of it, and eventually move it clockwise/counterclock wise to have the paste spreaded.<br><br>
However, I'm using the 478 stock heatsink, and I'm not sure that when i'll put it back on the processor, I'll be able to move it at all. Isn't it fixed firmly?
 

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What do you clean it with? And you shouldn't be able to move it at all
 

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you can clean off the top of the processor with rubbing alcohol which works well as a cleaner. <img alt="" class="inlineimg" src="/images/smilies/smile.gif" style="border:0px solid;" title="Smile"> also makes it easier to apply to a clean surface.. dont do what the idiot did in my avatar<br><br>
HS/FAns are designed to be removed from the processor.. for future upgrades/cleaning. ect.
 

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Discussion Starter #4
I don't think you understood me correctly.<br><br>
I already cleaned the surface with alcohol. My problem is when applying the thermal paste. I know I should put a dot-size of the material, and then in order to smear I can turn the heatsink clockwise/counterclockwise. But when I put the heatsink back it's firmly locked, so how can I move it in order to smear the paste?
 

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Put a dot on it.<br>
Seat heatsink.<br>
Keep twisting heatsink for 1 minute or so.
 

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<div style="font-style:italic;">I don't think you understood me correctly.<br><br>
I already cleaned the surface with alcohol. My problem is when applying the thermal paste. I know I should put a dot-size of the material, and then in order to smear I can turn the heatsink clockwise/counterclockwise. But when I put the heatsink back it's firmly locked, so how can I move it in order to smear the paste?</div>
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okay heres the thing..<br>
socket 478 processors "Dye" is in the center of the processor.<br>
if you were to just put a rice sized application of thermal paste and the put the heatsink on you should be fine <img alt="" class="inlineimg" src="/images/smilies/smile.gif" style="border:0px solid;" title="Smile"><br>
also take into account that it takes like 100hours for the thermal paste to cure and start working at 100% potential <img alt="" class="inlineimg" src="/images/smilies/biggrin.gif" style="border:0px solid;" title="Big Grin"><br><br>
EDIT** you should not have to twist the HS/fan in anyway on 478 processors <img alt="" class="inlineimg" src="/images/smilies/smile.gif" style="border:0px solid;" title="Smile">
 
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Discussion Starter #7
thank you<br><br>
what do you mean by "dye"?<br>
and shouldn't I twist it at all?<br><br>
gonX: that's the thing - I think it gets firmly locked after putting it on the processor.
 

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1. it wont lock if you put the HS/fan on the processor (if you mean lock then he is refering to the CLIPS that the stock hs/fans use <img alt="" class="inlineimg" src="/images/smilies/smile.gif" style="border:0px solid;" title="Smile"> and they can be uasily unlocked <img alt="" class="inlineimg" src="/images/smilies/smile.gif" style="border:0px solid;" title="Smile"> )<br><br>
2. the dye is what makes your processor hot. it is underneath the shiny silver top of your processor.. if you look at my avatar there is a black square in the middle of that processor. that is the dye of the processor<br><br>
3. socket 478 processors has their dye in the center of the processor. you should not have to twist the HS/fan to spread the thermal paste anywhere because it is in the middle of the processor and when you put the hs/fan down it will smoosh the paste in the center which is where you will need it most.
 

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Discussion Starter #9
Thanks guys.<br><br>
I did what you told me, but I have to admit that after putting the heatsink down on the cpu, I couldn't move it much around - basically I could only tilt it. Is that enough(I'm not just referring to the 478, but generally - would that be enough?).<br><br>
Does the fact I'm getting normal temps(42-45c idle, 60c full load - presscot cpu) mean that I did things right?
 

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Originally Posted by <strong>GGuyZ</strong>

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<div style="font-style:italic">Thanks guys.<br />
<br />
I did what you told me, but I have to admit that after putting the heatsink down on the cpu, I couldn't move it much around - basically I could only tilt it. Is that enough(I'm not just referring to the 478, but generally - would that be enough?).<br />
<br />
Does the fact I'm getting normal temps(42-45c idle, 60c full load - presscot cpu) mean that I did things right?</div>

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</div>Yes, if your temps are normal you did an OK job. For future reference, alot of folks around the forum (including myself) have found that better results can be had by applying the AS5, and then using a credit card to smear it evenly over the IHS/CPU Die. You might consider doing it that way next time. When you put on the AS5 and rotate the HSF you are not covering the entire surface area of the IHS, which can lead to elevated temps because of bad/no contact.
 

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Wouldn't this have been a good place to start?<br />
<a href="http://www.arcticsilver.com/ins_route_step2intelas5.html" target="_blank">http://www.arcticsilver.com/ins_rout...2intelas5.html</a>
 

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Discussion Starter #12
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<div style="font-style:italic">Yes, if your temps are normal you did an OK job. For future reference, alot of folks around the forum (including myself) have found that better results can be had by applying the AS5, and then using a credit card to smear it evenly over the IHS/CPU Die. You might consider doing it that way next time. When you put on the AS5 and rotate the HSF you are not covering the entire surface area of the IHS, which can lead to elevated temps because of bad/no contact.</div>

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</div>I know that credit card/knife smearing method. but it seems harder to me - how can you tell if you evenly smeared it?<br />
Besides, AS5 website says to use the dot method, and I guess they know what they're talking about right?<br />
What I don't get is how you guys move the heatsink around after putting it on the processor. I was only able to tilt it a little bit.<br />
<br />
billbartuska: I always read before I ask. I've read this and countless of FAQs before asking here.
 

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<div style="font-style:italic">I know that credit card/knife smearing method. but it seems harder to me - how can you tell if you evenly smeared it?<br />
Besides, AS5 website says to use the dot method, and I guess they know what they're talking about right?</div>

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</div>So long as you smear the AS5 over the entire surface area of the IHS, you should be ok. It doesnt have to be smeared completely even, as the pressure exerted by the HSF onto the IHS will even it out itself (any access will be squeezed out). Ill admit it is harder, but I think the small amount of extra work is worth it when you see lower temps. As for AS5 saying use the dot method... well, you cant argue with results! (Read: The Manufacture is not always right)
 

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Originally Posted by <strong>GGuyZ</strong>

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<div style="font-style:italic">I know that credit card/knife smearing method. but it seems harder to me - how can you tell if you evenly smeared it?<br />
Besides, AS5 website says to use the dot method, and I guess they know what they're talking about right?<br />
What I don't get is how you guys move the heatsink around after putting it on the processor. I was only able to tilt it a little bit.<br />
<br />
billbartuska: I always read before I ask. I've read this and countless of FAQs before asking here.</div>

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</div>Many posts refer to heating up the heatsink before applying the paste to make it easier to spread.<br />
Many posts refer to removing the heat sink to check how the paste spread. Then when you are confident you can get a good application leave the HS on.<br />
Many posts refer to checking temps and re applying and rechecking temps until you know you have a good application.<br />
No posts I have read refer to "tilting" the HS. Many posts refer to a clockwise/counterclockwise twisting.<br />
<br />
The only variation to the AS5 directions is with lapped parts. Then a thin "haze" is all that is required.
 

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Discussion Starter #15
Thank you.<br />
<br />
Have you checked both methods yourself? <br />
I was told the same exact thing by different fellas, with the exception of them recommending the opposite, using the same argument of "can't argue with results".<br />
<br />
So you can see why I'm getting confused here. Different strokes for different folks I guess?<br />
<br />
BTW, a bit out of topic: I could have done a better job by the way, because I had problems putting the heatsink back and had to mess with it(so it was lifted an inch or so above the processor after applying the thermal paste).<br />
<br />
But mainly I'm happy, because here are the results I got from this process:<br />
Before cleaning HSF & applying new thermal paste- 53c idle, 73c load.<br />
After: 41c idle, 60c load.<br />
<br />
12c decrease! not to mention the fan runs 1200RPM SLOWER than before.
 

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I have personally tried both methods, and found the one I suggested works better, keeping temps 2-3c lower then the other. Also, here is a link to a thread where I suggested to another forum to try the credit card method over the rotate the hsf method, he saw similar results: <a href="http://www.overclock.net/amd-air-cooling/118361-52c-new-cpu.html#post1267047" target="_blank">http://www.overclock.net/amd-air-coo...ml#post1267047</a><br />
While these results are inconclusive on their own, I would think together, and with the multitudes of people that have tried the credit card way and see similar results, that there is definatly something to be said for spreading the TIF over the whole surface area of the IHS with a CC.
 

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<div>Originally Posted by <strong>GGuyZ</strong></div>
<div style="font-style:italic;">Thank you.<br><br>
BTW, a bit out of topic: I could have done a better job by the way, because I had problems putting the heatsink back and had to mess with it(so it was lifted an inch or so above the processor after applying the thermal paste).</div>
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You're welcome. Lifting the HS can cause air to get trapped between the HS and CPU. AS5 tends to leave sharp pointy peaks when pulled apart. These can leade to trapped air bubbles. See what I mean about trying it over and over until your temps show you that you have done it to the best of your ability?
 

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Discussion Starter #18
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<div>Originally Posted by <strong>billbartuska</strong></div>
<div style="font-style:italic;">You're welcome. Lifting the HS can cause air to get trapped between the HS and CPU. AS5 tends to leave sharp pointy peaks when pulled apart. These can leade to trapped air bubbles. See what I mean about trying it over and over until your temps show you that you have done it to the best of your ability?</div>
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<br>
There seems to be some kind of problem in the communication between us.<br>
If you'd read again what I said you can see that I wasn't referring the 'tilting' part as a good thing. In fact, that was my question. How come many of the posts regarding applying thermal paste ask you to twist the heatsink clockwise/counterclockwise, and when I put it on the processor I was only able to tilt it a little bit. It gets stucked in it's socket and you can't move it around too much.<br>
And of course I didn't close any of the handles, so that's not the reason.
 
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