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799 Posts
Original Problem: ANSWERED
Alright, I just got a new Mobo for my Q6600 cause my last one sucked at OCing. So I install everything, put on a new application of AS5 (cooler in SIG)....on the old mobo with this cooler, I got temps <70C no matter what Vcore I was at.
So I put the new one on, it looks great - idleing at 26 at stock voltage. So I bump up the voltage and FSB. I boot up windows and run Prime95 - boom, goes to 80-90-100C....I was like *** and quickly turned it off.
I then reset the HSF (I can't get it to work worth crap because of the horrible connections LGA 775 sockets use. So now I think its on good, I try it again -SAME RESULT
So then I think....too much AS5 and take some off. Reseat and boom, SAME THING.....
I am at vcore = 1.45 and my idle temps are 31-35 depending on the core - but as soon as I stress, it jumps rediculously high.......
Help!!!
Question Two: ANSWERED
What is the best way to spread thermal compound. I have read about 20 different ways and everyone argues their way is best. I have tried the drop a glob in the middle and let the HS spread method, the do a line and let the heat sink spread, the prime the HS and then spread a thin layer evenly over the CPU with either Finger in bag or credit card method.....
What would the best way be for me with a Quad Core Q6600 (I know the dies are in different places then normal C2Ds) and the XIGMATEK HDT-S1283 which has 2 copper pipes that make direct contact with the CPU but has aluminum between them.....
One person suggested putting some AS5 in the gaps between the copper pipes and aluminum and them putting a line on either pipe the length of the CPU. Then just attach it and let it spread......
Any advice for people who have these setups or something similar????
Thanks
QUESTION THREE: PENDING
I read that you face the arrows on the pins away from the HS and the grove in the top should be facing the HS......so now my question is, are you supposed to twist as you press down on the pin? (by pins I mean the 4 arms that attach to the motherboard)
Alright, I just got a new Mobo for my Q6600 cause my last one sucked at OCing. So I install everything, put on a new application of AS5 (cooler in SIG)....on the old mobo with this cooler, I got temps <70C no matter what Vcore I was at.
So I put the new one on, it looks great - idleing at 26 at stock voltage. So I bump up the voltage and FSB. I boot up windows and run Prime95 - boom, goes to 80-90-100C....I was like *** and quickly turned it off.
I then reset the HSF (I can't get it to work worth crap because of the horrible connections LGA 775 sockets use. So now I think its on good, I try it again -SAME RESULT
So then I think....too much AS5 and take some off. Reseat and boom, SAME THING.....
I am at vcore = 1.45 and my idle temps are 31-35 depending on the core - but as soon as I stress, it jumps rediculously high.......
Help!!!
Question Two: ANSWERED
What is the best way to spread thermal compound. I have read about 20 different ways and everyone argues their way is best. I have tried the drop a glob in the middle and let the HS spread method, the do a line and let the heat sink spread, the prime the HS and then spread a thin layer evenly over the CPU with either Finger in bag or credit card method.....
What would the best way be for me with a Quad Core Q6600 (I know the dies are in different places then normal C2Ds) and the XIGMATEK HDT-S1283 which has 2 copper pipes that make direct contact with the CPU but has aluminum between them.....
One person suggested putting some AS5 in the gaps between the copper pipes and aluminum and them putting a line on either pipe the length of the CPU. Then just attach it and let it spread......
Any advice for people who have these setups or something similar????
Thanks
QUESTION THREE: PENDING
I read that you face the arrows on the pins away from the HS and the grove in the top should be facing the HS......so now my question is, are you supposed to twist as you press down on the pin? (by pins I mean the 4 arms that attach to the motherboard)