[drnilly007]

Build will will be in 2 parts. Before and after delid
Mobo: ASUS Z790 TUF
CPU: 13900K
Memory: Either G.Skill Trident Z5 RGB 32GB DDR5 6600 CL34-40-40-105 1.40V F5-6600J3440G16GA2-TZ5RS or Kingston Fury 6000 CL36-40-40 1.35 whichever clocks better.
PSU: MSI Mag 1000 PCI 5.0
Case: 011 Evo
GPU: 4090 Founders (Air for now)
CPU Block: EK Optimus 2 Black/Nickel stock will test then switch to delid direct die
Rad: Alphacool UT60
Fans: Lian Li Uni 120 x6 , 3x …
Pump/Res: EK Kinetic 200mm D5
EK fittings
First test fit to get ideas:

 

[drnilly007]

First issue 011 Evo rear motherboard cut out probably not designed with LGA 1700 in mind. Cannot install Ek direct mount backplate. (Yes I know backplate upside down)

Reserved

 

[Martin v r]

rad not in top,you got hot temps from gpu ,I also made that mistake in my first build, have changed it now

 

[StAndrew]

Get some 1/4" foam weather stripping and place behind your CPU die. Layer it so where you can comfortably place the CPU into your socket and compress the foam in the motherbaord socket so that there is pressure behind the CPU, pushing outwards. Does that make sense? This will help with getting proper pressure / contact with your CPU die and waterblock.

 

[kairi_zeroblade]

Ohh..you seem to have went Intel as well..nice build!! Mine's coming up as well this weekend..dumped AMD and the hype and never looking back again..hahahaha..

 

[drnilly007]

rad not in top,you got hot temps from gpu ,I also made that mistake in my first build, have changed it now View attachment 2605228 View attachment 2605229

I almost always put the rads on top. I like the hot air to not be blown into the system. Looks like front panel of your case is solid? Yeah I’ve done dual gpu water cooled builds.

Get some 1/4" foam weather stripping and place behind your CPU die. Layer it so where you can comfortably place the CPU into your socket and compress the foam in the motherbaord socket so that there is pressure behind the CPU, pushing outwards. Does that make sense? This will help with getting proper pressure / contact with your CPU die and waterblock.

Not sure why I’d need foam. I just cut out notches in motherboard tray so I can keep the motherboard mounted flat as possible, and to be able to remove the back mount plate when I delid.

Ohh..you seem to have went Intel as well..nice build!! Mine's coming up as well this weekend..dumped AMD and the hype and never looking back again..hahahaha..

I was gonna go for AMD or Intel just depended on what delid kit derbauer released first and had direct die blocks made the choice easier for me.

 

[StAndrew]

Not sure why I’d need foam. I just cut out notches in motherboard tray so I can keep the motherboard mounted flat as possible, and to be able to remove the back mount plate when I delid.

Its an older direct die trick to make sure A: you get good mounting pressure and B: You don't damage your die

It appears EK did a good job in dialing in the mounting pressure so your CPU doesn't get damaged but from what I've seen so far, that means the mounting pressure is not great and there are some grumblings about temps.

Using a foam weather strip (something like THIS), attach it to the capacitors behind the CPU die, just thick enough (for my 8700k, IRRC, I used two 1/4" or 1/8" thick foam layers) that you can feel resistance pushing up form the back of the CPU die, but you can still easily place it into the socket; you don't want too much pressure. Anyways, not required but certainly a recomendationg. If you are interested, I will be selling my 12th Gen Supercool DD block, probably this weekend. From what I've seen/read, its about 5-10*C better than the EK DD block (and doesn't require the foam as its mounted the same way you mount an IHS.

Here is my best MSPaint representation (black is the CPU and green is the foam):