1/ Both CPU and IHS need to be perfectly flat, this in itself is the main issue.Hi Guys,
A quick question: I bought some Thermal Grizzly liquid metal for using in a custom water cooling loop using AquaComputer waterblock, on a Ryzen 3950x (and in future a 5950X). It seems that liquid metal is a very popular solution to use when deliding the CPU, and use it between the actual silicon and the thermal plate (and that makes sense especially when they are using a thermal paste and are not being soldered together).
But my question is: does it make sense to use liquid metal if I do not intend to delid the CPU? Should I expect some better performance still? or it's not worth the trouble (and risk of shorts...). Would I be better off just using some high performance thermal paste? And are AMD CPUs soldered thermal plate? or they use thermal paste internally?
2/ As long as both surfaces mate perfectly when bolted down liquid metal can provide some nice improvements in temps but nothing that should make a noticable difference in maximum overclock potential
3/ Using liquid metal will mess up the imprint on the CPU IHS as well as leaving residue on heatsink
4/ If both surfaces are not nickle but one is copper you will need to re-apply the liquid metal as the copper will absorb the first application after being used for a month or so
That covers it for me