Actually, I use a little less.
A dot in the middle works just fine for me.
Like this:
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A dot in the middle works just fine for me.
Like this:
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That looks like way too much.
Originally Posted by ProjecT TimeZ Actually, I use a little less. A dot in the middle works just fine for me. Like this:
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It is actually recommended by the manufacturer to use a larger than normal amount to ensure that the paste spreads correctly.
Originally Posted by justarealguy That looks like way too much. |
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actually that creates air pockets i your TIM spread, in turn causing higher temps.
What i do is aply some in the very middle of the cpu enough that i know the cores and not the entire IHS will get covered) and then i set the HSF down on the cpu. (i have a bolt mount system and because of that, this method works perfectly) Then i power on the computer and keep it on its side so that the cpu will warm up the TIM. Then i start to turn the screws slowly so that the pressure from the cpu against the SF and the heat from the cpu ensure a proper spread of the TIM without air pockets in the application.
Originally Posted by Adrienspawn Add 4 more uber-small dots towards the 4 corners. |
What i do is aply some in the very middle of the cpu enough that i know the cores and not the entire IHS will get covered) and then i set the HSF down on the cpu. (i have a bolt mount system and because of that, this method works perfectly) Then i power on the computer and keep it on its side so that the cpu will warm up the TIM. Then i start to turn the screws slowly so that the pressure from the cpu against the SF and the heat from the cpu ensure a proper spread of the TIM without air pockets in the application.
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An X pattern for IC7 is the worst thing you could think about doing. The manufacturer went through alot of time and trouble finding the best way to apply the TIM. A 5mm dot in the center of your cpu is exactly what you should do.
Originally Posted by gnolnats Applying in an "X" pattern works the best. The very best way to get it right is to try several different approaches and remove the heatsink to see which is best. You want to avoid excess oozing out the side of the cpu which will trap heat. Use as little as possible, an uncooked rice grain size is about what I use. |
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You are correct.
Here are the instructions for application of IC Diamond - http://www.innovationcooling.com/app...structions.htm
Originally Posted by jacksknight An X pattern for IC7 is the worst thing you could think about doing. The manufacturer went through alot of time and trouble finding the best way to apply the TIM. A 5mm dot in the center of your cpu is exactly what you should do. |
Here are the instructions for application of IC Diamond - http://www.innovationcooling.com/app...structions.htm
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