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Lapped X3220 (Q6600) to the core

5071 Views 21 Replies 20 Participants Last post by  mega_option101
Well I lapped my X3220 all the way to the cores. Took more time then I care to admit wasting on the project. It was a B3 and I figured if this was gonna help out a cpu temp wise a B3 would be the one that needed the help.

Well temps idle before at 1.4vcore and temps after this mod exactly the same. Not a change at all. 32/32/28/27 (roughly average). Load prime 60/60/58/58. This is with my water cooling system.

I reseated it several times and tried it with both arctic silver 5 and then ICD. The ICD was maybe a 1c more across the board.

Ahh well, was worth a try. Dont know maybe I put too much thermal paste on each time, maybe not.

You guys that have done this before you gotten any better results with different thickness of thermal paste.
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I saw someone else do this...and you. Nice job!

~Gooda~
That's hardcore.
I applaud your efforts.
Quote:

Originally Posted by rmvvwls View Post
That's hardcore.
I applaud your efforts.
Thanks just wish they had been a little more worth it lol.
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Just a theory, but possibly the IHS on the chip being removed did not have much gain due to the heat not being spread as evenly along the HS?

Very possibly wrong, but it's worth a quick thought.
After that you must have biceps of steel and forearms of doom.
Is this dangerous at all? Lapping it down that far? Now you got me wanting to do this to my Phenom II. ^^
Damn sexy (s)lapping!
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Originally Posted by Imglidinhere
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Is this dangerous at all? Lapping it down that far? Now you got me wanting to do this to my Phenom II. ^^

only dangerous if you apply too much pressure. The IHS was made to protect the cores and spread the heat. but without it the cores are revealed and if you apply too much pressure from a heatsink you could possibly kill a perfectly good CPU
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Arctic Silver takes like 200+ hours to really break in...you wait that long?
Craazyy.. could be because there is less contact between the cpu and the waterblock
Both INTEL and AMD solder the cores to the HEATSINK these days. Before they were using TIM. So thats why you're temps are the same. Nice job.
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Originally Posted by IOSEFINI
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Both INTEL and AMD solder the cores to the HEATSINK these days. Before they were using TIM. So thats why you're temps are the same. Nice job.

You mean the ihs? The heatsink is removable and people use TIM for that.
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Originally Posted by McStuff
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You mean the ihs? The heatsink is removable and people use TIM for that.

Yes, the IHS
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lapping only makes the heat spreader have better contact with the heat sink/waterblock

so it doesn't really matter if you did all the way down...

good try though =D
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