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Discussion Starter #1
Hey guys, i've just ordered Coollaboratory 1x Liquid PRO, 1x Ultra and Indigo Extreme for the 3770k temp drop operation
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450

So far i have lapped the IHS which resulted in a somewhat ok temp drop 5c.
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When they arrive to me from Germany, i will de-lid the IHS and apply the Liquid Pro on the chip then stick the IHS back on. This should result in even better results than the fluxless solder Intel normally use on their CPU's.
Indigo Extreme for CPU to Heatsink, in my case a Koolance 360 CPU waterblock.

AIM: The project aim is to minus 25c ! Stay tuned and wish me luck !
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EDIT: ETA of coolaboratory products is 25 -27th JULY.

UPDATE: 29th July.
I'm starting to think the products from Germany aren't going to arrive at all.
Ive contacted Coollaboratory and they said it has definitely been sent. its been almost 3 weeks now.... still nothing.
But rest assured, if it does miraculously show..i will update with results
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Discussion Starter #3
EDIT: CPU is KIA, scratched the core with the knife while popping the lid, so i decided to go balls out.....^___^

UPDATE:
So my 3770k is dead with a shattered die/core...
Here is the replacement 3930k build with a rampage iv formula !
This beats de-lidding i swear lol... And here a sneak peak of the Corsair Dominator Platnium 2666mhz 16gb cl10

3770k to hell.... i'm doin 4.7ghz @ 1.35v - 70-75c max temps.



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That'll be interesting. I plan on doing my 3770K too.
Also why not use Coollaboratory Liquid Ultra between CPU and waterblock?
 

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Discussion Starter #9
Quote:
Originally Posted by Willhemmens View Post

That'll be interesting. I plan on doing my 3770K too.
Also why not use Coollaboratory Liquid Ultra between CPU and waterblock?
Definitely will be reviewing both the IX and ULTRA applications to the heatsinks for results.
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The Pro is no good for Heatsink application cause apparently it "welds".
 

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Quote:
Originally Posted by Renairy View Post

Definitely will be reviewing both the IX and ULTRA applications to the heatsinks for results.
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The Pro is no good for Heatsink application cause apparently it "welds".
It only welds cheap aluminium blocks. Copper and nickel is fine.
 

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A.K.A. Droptimus
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I just tried this and gave up, apparently if you have already used the 3770k prior to attempting to delid it becomes much more difficult.... because the force from your motherboards cpu bracket makes it even tighter, I couldn't even get my blade between the pcb and the ihs.. but GL hope it works out.
 

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Quote:
Originally Posted by iPDrop View Post

I just tried this and gave up, apparently if you have already used the 3770k prior to attempting to delid it becomes much more difficult.... because the force from your motherboards cpu bracket makes it even tighter, I couldn't even get my blade between the pcb and the ihs.. but GL hope it works out.
I had the exact same problem, and gave up too. I think my Thermalright True Spirit 140 retention bracket is so tight, that now not only is there no room to wedge an X-acto blade between IHS and PCB, but the IHS pressure ledges are clearly dented from the TS140. Hopefully that means better contact (not that it matters without delidding), but damn!
 

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need update!
 
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