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Q6600 @ 3.0 w/ Tuniq Tower (Too Hot)

1416 Views 32 Replies 12 Participants Last post by  Sullivan, 
V
3
I built this last summer.

NZXT Tempest
Intel Core 2 Q6600 @ 2.4GHz G0 (Kentsfield)
2x2GB Patriot DDR2 800
EVGA 8800GTS 640MB
Western Digital 500GB SATA
Corsair 750W PSU (overkill?)
Asus P5K Pro Motherboard
Asus LightScribe DVD-RW

I'd been wanting to overclock for a while, so I ordered the Tuniq Tower last week. It's idle temperatures seemed ok (mid-30s if I remember correctly). After some research I tried overclocking at 337MHz FSB x 9 Multiplier, with 1.325v. This is what speedfan told me:


On the warm side. I ran Prime95 for two minutes and it reached this:


Scared me, so I put a stop to that. I think I have a more-than-ample layer of thermal grease under the Tower, so it's hard to imagine that's the problem. And I have its fan running at ~2000rpm. Only thing I'm worried about with the cooler is about a 1mm sag furthest away from the motherboard. I have tightened screws, but it persists. Problematic, or no?

If speedfan's "System" temperature is the ambient (I'm assuming it is?), it seems too high. One of the Tempest's front intake fans stopped working, possible cause, or maybe it's the 750W PSU?

My first overclock, so go easy. I'll consider my failed attempt a learning experience.

CPU-Z Screenshot:


Thanks in advance,
Niko
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gibsonnova74
Could be a combination of several things.

(1) You might need a reseat.

(2) You could of used too much compound

(3) How is your air flow?

(4) What is your ambient temp?(room temp)
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G
Quote:



Originally Posted by vNiko
View Post

I think I have a more-than-ample layer of thermal grease under the Tower, so it's hard to imagine that's the problem.
Niko

There's your problem.

Apply your thermal compound (which one did you use BTW?) according to this video.




YouTube - How do you apply Artic Silver 5 ?


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V
I'm a little concerned about the airflow because 1/2 of the front intake isn't working, but I think it's decent, in general. Room temperature is about 70F/21C. My thermal compound (Arctic Silver 5) stays between the surfaces, doesn't seep over the CPU's edges. Is it possible that it's still too much?

I reseat last night, but I could try again.

EDIT: Hadn't seen your post, GSingh - I will clear it off and try to apply like in the video. I definitely used a LOT more than shown there. Screwing the Tuniq Tower back in is extremely tedious, however, because even with my small hands I can't get the back screw in with it centered. I need to rotate the tower slightly, so some of the compound will get smeared.
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heathmcabee
Ya, I would recommend a Re-seat. You shouldn't be getting temps like that on idle. Make sure you use the dot method in the center and the HSF will spread it out. Too much thermal paste is bad. You are just trying to fill the gaps with the TIM in where the HSF and the IHS are not making contact. Should fix your problem.
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Sullivan
I have the TuniqTower 120 also, I applied a little more then a bb or grain of rice, make sure yo have it mounted in the direction like mine:

*This was before some of my wire management.*


And make sure when you screw it down, that the H-Bracket is bending over the copper section of the mount, but DO NOT OVER TIGHTEN!
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V
Mine is definitely mounted horizontally.. Another thing to fix when I reseat.
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Sullivan
Ya, what case do you have?

The Main reason for seating it like mine, is that it blows hot air out to the back fan, look in mine.

Hot air is blow directly from the heat sink to the exhaust fan.
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V
Case: NZXT Tempest

With the H-Brace going vertically, it would probably reduce the leaning, also increasing the contact area. : ) Installation will also seem easier (more space for hands in back when installing the tower vertically), and I'll make sure to position it so it's blowing towards the exhaust.
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Sullivan
Good job then.

I don't think the position you place the H brace really matters, as long as all screws are nicely screwed down, remember, use the criss cross method.

Start in one corner, screw it down just a little till it gets started, then go clockwise, and continue screwing in a little on each screw at a time, rotating.
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L
I don't think anyone mentioned this, but speedfan is known for giving bad CPU temp readings. See what temps core temp says you're getting.
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V
Ok, I'll go ahead and start working. Will post results when I'm done.

EDIT: I looked into the readings before, as well. SpeedFan and CoreTemp are pretty much identical for me.
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D
I always apply my TIM(AS5) using the same method as in the video previously posted, except that I use plastic wrap (saran wrap/cling wrap) on my finger as it is thinner and forms better to your finger than the material used in the video. As you seen in the video, the person spreading the TIM out had a hard time keeping it even and left ridges...using plastic wrap allows more control. Either way, the HSF will help to evenly spread it out anyway...I'm just a perfectionist and like my TIM application to look perfect before I install a HSF.

Since you are working with the Q6600 and would probably want to OC over 3GHz, I would recommend lapping, at least, the heatsink base. Personally I would lap the IHS of the CPU and the heatsink base. This will provide maximum heat transfer from the CPU to the HSF and help to evenly cool each core. You can get the lapping kit from FrozenCPU or just buy the different grits of sandpaper and follow the same method.
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G
You need to lap it. My friend's Tuniq Tower had a horrible base and he saw a huge drop in temperatures after lapping both the CPU and cooler.
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Sullivan
Ya, mine has a horrid base too, I plan on lapping mine before I oc.
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L
Quote:


Originally Posted by Dark Volker
View Post

I always apply my TIM(AS5) using the same method as in the video previously posted, except that I use plastic wrap (saran wrap/cling wrap) on my finger as it is thinner and forms better to your finger than the material used in the video. As you seen in the video, the person spreading the TIM out had a hard time keeping it even and left ridges...using plastic wrap allows more control. Either way, the HSF will help to evenly spread it out anyway...I'm just a perfectionist and like my TIM application to look perfect before I install a HSF.

Since you are working with the Q6600 and would probably want to OC over 3GHz, I would recommend lapping, at least, the heatsink base. Personally I would lap the IHS of the CPU and the heatsink base. This will provide maximum heat transfer from the CPU to the HSF and help to evenly cool each core. You can get the lapping kit from FrozenCPU or just buy the different grits of sandpaper and follow the same method.

TIM shouldn't be spread around as that promotes lots of air bubbles. A small dot in the middle of the IHS is the best way to go as far as temps are concerned.

And yeah lapping would help but buy the sandpaper and glass yourself, as that kit is a bit overpriced and doesn't even come with glass. That piece of plexiglass isn't that great, it flexes under the weight of the heatsink, which isn't a good thing.
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D
+1 for lapping. Although I think case airflow may explain the OP high temps here if speedfan is telling the truth.

My OCZ Gladiator max was terribly twisted and the IHS I think had been pressed with a blunt die and a rubber hammer on a Friday afternoon! Lapping good for anything between a couple and several degrees improvement.
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D
Quote:

Originally Posted by ljason8eg View Post
TIM shouldn't be spread around as that promotes lots of air bubbles. A small dot in the middle of the IHS is the best way to go as far as temps are concerned.

And yeah lapping would help but buy the sandpaper and glass yourself, as that kit is a bit overpriced and doesn't even come with glass. That piece of plexiglass isn't that great, it flexes under the weight of the heatsink, which isn't a good thing.
If you rely only on the pressure of the heatsink base to spread the TIM, do you really get even coverage? I would think that the TIM would be thicker in the middle of the IHS and thinner or non-existent towards the outside edges. Wouldn't this cause higher temps on some cores and lower on others?
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Sullivan
Ya, I am sure I have every grit of sand paper, so I should be set.

I tried spreading the thermal paste, on my first build 3 weeks ago.

Well the temps were horrible, due to me spreading to thin. I suggest do NOT spread.
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L
Quote:

Originally Posted by Dark Volker View Post
If you rely only on the pressure of the heatsink base to spread the TIM, do you really get even coverage? I would think that the TIM would be thicker in the middle of the IHS and thinner or non-existent towards the outside edges. Wouldn't this cause higher temps on some cores and lower on others?
No, the heatsink spreads it evenly when you bolt it down, and even more so when it gets warm.
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