So I have noctua NT-h1
Should i apply a thin layer on my i7 with a plastic card and mount my XSPC water block?
I did a grain of rice which should be covering the whole cpu but i am a paranoid mofo
i dont want my chip looking like this
i also know i am not supposed to spread paste around the cpu but to let pressure close it down to provide an even spread with no air bubbles
in this situation should i just go ahead and spread the thinnest layer to cover? or put a rice grain in the middle and let it expand out potentially not covering every millimeter of the IHS
Should i apply a thin layer on my i7 with a plastic card and mount my XSPC water block?
I did a grain of rice which should be covering the whole cpu but i am a paranoid mofo
i dont want my chip looking like this
i also know i am not supposed to spread paste around the cpu but to let pressure close it down to provide an even spread with no air bubbles
in this situation should i just go ahead and spread the thinnest layer to cover? or put a rice grain in the middle and let it expand out potentially not covering every millimeter of the IHS