Quote:
< sarcasm > Are they glued together? </ sarcasm >
Source:
http://www.tomshardware.com/news/intel-emib-interconnect-fpga-chiplet,35316.html
EDIT: Fixed the link
Intel is discussing using what looks like multiple dies at first glance.Transitioning to a heterogeneous design, which combines several separate components onto a single package, solves several problems. First, the smaller dies sidestep yield problems by reducing the chance of catastrophic defects. It also allows Intel to combine several different components with different processes onto the same package. That lets the company use larger nodes for the harder-to-shrink or purpose-built components. It also decouples development cycles for analog and digital devices, thus decreasing time to market.
< sarcasm > Are they glued together? </ sarcasm >
Source:
http://www.tomshardware.com/news/intel-emib-interconnect-fpga-chiplet,35316.html
EDIT: Fixed the link