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It wouldn't damage the CPU.

At least on person on this forum has taken a heatgun to his CPU in order to reflow the solder under the IHS.
 

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Quote:


Originally Posted by michinmuri
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I don't wanna go that far (I think.) I just want better conductivity than paste, and was thinking maybe solder would be a good bet even if permanent.


Of course.

My point is that the heat won't damage the CPU.

As long as it is not in the board, running, it can take massive amounts of heat. Obscene amounts.

I say go for it.
I've tossed the idea around a bit myself.

It will obviously work great.
I'm certain solder will conduct heat very well, and it will maximize the surface area between CPU and heatsink.

Keep in mind that too much TIM acts as an insulator, but too little results in less contact area between CPU and heatsink, which means that it is inevitable that you aren't getting optimal heat transfer.
Lapping helps of course, but still isn't perfect.
 
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