I have heard that I must use liquid metal between the die and the IHS after delidding and that if I want to use thermal paste between the die and the IHS, I shouldn't even delid.
I have also heard that using thermal paste between the die and the IHS causes the pump-out effect which is bad....is this true ?
I have an i5-6600K and an i7-7700K that I may want to delid but I don't wanna use liquid metal.
Do you recommend delidding and using thermal paste between the die and the IHS ? isn't the thermal clay that intel uses completely dried out by now? Will my temps improve if I delidd and use thermal paste under the IHS ?
If you recommend delidding, which thermal paste do you recommend for between the die and the IHS ?
I have also heard that using thermal paste between the die and the IHS causes the pump-out effect which is bad....is this true ?
I have an i5-6600K and an i7-7700K that I may want to delid but I don't wanna use liquid metal.
Do you recommend delidding and using thermal paste between the die and the IHS ? isn't the thermal clay that intel uses completely dried out by now? Will my temps improve if I delidd and use thermal paste under the IHS ?
If you recommend delidding, which thermal paste do you recommend for between the die and the IHS ?