Just for those interested in pad thickness setup for Bitspower DDR5 kit.
I had to tear down my heatsink twice because it was not sitting centre with the heatsink.
I figured out the optimal thickness so that under clamping pressure, the sticks do not slant.
The most important pad for this setup is the empty side of the stick. There is a PMIC trace layout and you need to put a 1.5mm thick pad around 2cmx1.3cm (Be careful it does not overlap with the lower part of the heatsink which sits higher or you will have problems clamping). If you do not have back support on the PMIC with enough thickness, you will end up slanting the modules under pressure so this PMIC pad levels the entire stick once you start to tighten it down.
Just by adding the PMIC thermal pad on the rear with 1.5mm thickness allowed me to drop 3 degrees more on SPD Hub temps. I believe there is better pressure on the PMIC on the front due to this back support. The entire setup now is solid as a rock and does not wiggle or move despite repeated installing and removing of the rams.
Summary of what I used :
RAM Kit - G.Skill 7800C36 Kit
Front RAM chips - 1.0mm Gelid Extreme Thermal Pad (4.5cm x 1.0cm)
Front PMIC chip - 1.5mm Gelid Extreme Thermal Pad (2cm x 1.5cm)
Rear Ram Chips (Empty) - 0.5mm Gelid Extreme Thermal Pad (4.5cm x 1.0cm)
Rear PMIC traceout - 1.5mm Gelid Extreme Thermal Pad (2cm x 1.3cm)
Also, I pasted some thermal paste just above the green line as outlined below for better thermal transfer. Hope this helps you guys out if you are using the same kit.
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