Quote:

Originally Posted by thehighlander123 An evil idea came to me in my dream last night(yes i dream of watercooling) what if one where lap an IHS down to the copper as in standard lapping but mill micro channels in the top and somehow seal it up like a waterblock with the ihs acting as the base of the waterblock with an inlet squirting directly onto the center of the die and an outlet pulling water out of the bubble?chamber? im pretty sure this could work but i honestly have neither the tools nor the expertice to have this done so what do u guys think?

You dream of water cooling too? Thankfully I'm not alone... Anyway, that actually sounds like an interesting idea. How thick is the layer of copper on the top of the Processor? Does it even leave room for milling?

 

Quote:

Originally Posted by sledgehammer1990 You dream of water cooling too? Thankfully I'm not alone... Anyway, that actually sounds like an interesting idea. How thick is the layer of copper on the top of the Processor? Does it even leave room for milling?

And how deep milling would you be able to acheive? 1mm high water channels arent going to bring the best performance now are they?

Nice Idea though. I dream of naked Chips and IHS's mmmmh!

This one G92 winked at me!

 

This is what you are talking about correct?

 

Dude that is actually a damn good idea. Eliminate the extra layer between the coolant and the chip right?

Given the thickness of the IHS you probably couldn't actually use that piece of copper, plus you wouldn't need the nickel coating on the top side. What AMD and Intel need to do is sell an Extreme Edition type chip that comes naked from the factory so that a waterblock/pot can be applied directly.

 

It's been done before. Your biggest challenge will be sealing it off so that it doesn't leak.

 

Check these out.

..Direct Die Watercooling (Part 1) - spodesabode.com archive

..Direct Die Watercooling (Sunny D, Part 2) - spodesabode.com archive

..Direct Die Cooling Vs Danger Den (Part 3) - spodesabode.com archive

..Direct Die Cooling (Project O-Ring, Part 4) - spodesabode.com archive

 

As you said, the trick is in sealing it onto the ihs. Would an O ring work? How much pressure would be needed? Wouldn't it be less than the pressure that is commonly applied to a water block?

 

Quote:

Originally Posted by nub As you said, the trick is in sealing it onto the ihs. Would an O ring work? How much pressure would be needed? Wouldn't it be less than the pressure that is commonly applied to a water block?

an O-ring needs a groove to set in otherwise it will just blow outward with pressure

Yes less pressure would be needed as there the contact between the block and the ISH would not be there. You would only need the pressure to keep the block on and sealed

An IHS is very thin material 1mm channels are gonna be very close to breaking through the IHS but if your willing to try it im sure gonna be excited

 

LOL I never said I would try it out

The OP should though

This has gotten me thinking though. The ihs has open air spaces below it next to the cores correct? Would there be any benefit to lapping all the way through it, but leaving the edges intact, and filling it up with a non conductive tim?, with direct contact between the water block and the core?
I was thinking that would allow heat transfer from the sides as well as the top to the water block.
Probably an insane idea to lap through the ihs on purpose though...
If I can get an old dual core cpu for next to nothing I will try this out.

 

Quote:

Originally Posted by nub LOL I never said I would try it out The OP should though This has gotten me thinking though. The ihs has open air spaces below it next to the cores correct? Would there be any benefit to lapping all the way through it, but leaving the edges intact, and filling it up with a non conductive tim?, with direct contact between the water block and the core? I was thinking that would allow heat transfer from the sides as well as the top to the water block. Probably an insane idea to lap through the ihs on purpose though... If I can get an old dual core cpu for next to nothing I will try this out.

Yeah it would help a little, I don't know if I would fill the void with TIM or just have it on the die, try it both ways and see I guess. It may radiate more heat with the TIM around the sides to, use some Ceramique and it would be fine to try. There was a guy here that was lapping through the IHS like that. I'd just use a good file and file through it and then lap it down good and flat at the last. It would be a lot faster that way.

The old AMD's a lot of us used to razor the IHS off, it was good for several more C.

 

Ive been wanting to try this for a while actually...Ive got a few 939 cpus and taken the ihs off all of them. A spare waterblock and some silicone might work..but id be nervous the whole time its on the dam thing..just dont feel like risking my ultra D..ive got an old 467 rig i might try this on.

 

Quote:

Originally Posted by waqasr Ive been wanting to try this for a while actually...Ive got a few 939 cpus and taken the ihs off all of them. A spare waterblock and some silicone might work..but id be nervous the whole time its on the dam thing..just dont feel like risking my ultra D..ive got an old 467 rig i might try this on.

Yeah Man I wouldn't risk my Ultra D either, it would be hard to find another one.

Hey it looks like it would be fun to try...

..

 

Well if you/I/some sacrificial lamb tries this, would suspect that mx2 or ocfreeze would be better results than ceramique. Actually this might also help out when using air cooling. I wonder how much this would help temps on a TRUE.

 

Quote:

Well if you/I/some sacrificial lamb tries this, would suspect that mx2 or ocfreeze would be better results than ceramique. Actually this might also help out when using air cooling. I wonder how much this would help temps on a TRUE.

Im talking about running water directly over the cpu die..meaning eliminating the need of TIM, it cant work with a heatsink because the heasink base is what needs to be in contact with the cpu.

 

Quote:

Originally Posted by waqasr Im talking about running water directly over the cpu die..meaning eliminating the need of TIM, it cant work with a heatsink because the heasink base is what needs to be in contact with the cpu.

I realize this. The idea was floated about lapping all the way through the ihs to the silicon. I should have made a different thread. Sorry for the derail.