pics of applied thermal compound on 3900x CPU i mean the way you set it on would be differnt because of 12 core vs 8 core die size?

All you have to do is butter the entire IHS of your 3900x, from edge to edge.

Just don't pile on the paste but smoothly spread it all over so that it covers the IHS perfectly. Then you place your heatsink or AIO onto it.

Simple really, if you've done it before but if you didn't always remember that the paste has to be spread by you much like buttering any piece of toast in the morning for breakfast. Nothing complicated or difficult to understand here.

Remember that this latest Ryzen 2 design isn't like any previous Intel cpu's where it needed only one drop of paste in the middle, that is gone now when buying and using any AMD 3000 series.

 

but if you butter it wont it squish out the sides possibly going into socket? i have never done the butter way what should i use to do it?

 

I've spread TIM using strip off plastic card always, I can't say I've had massive squish over sides, used this on Intel/AMD, even on Threadripper.

I haven't got photo of my R5 3600 yet, but below is when I removed block off of R7 2700X after ~8mths, far right are just rough mockups I did while back to see how things are lying.

Spoiler

 

You would apply the paste the way you prefer to apply it. It doesn't matter if it's 12 or 8 cores.
Would be neat to see people's pictures of their methods. (cpu any?)

I feel like I've seen this thread elsewhere recently....

 

Many of the TIM manufacturers have started including little plastic spatulas to spread TIM with. They're handy, but you can use just about an small, flat, semi rigid surface just as well. Back in ye olden days, we used credit cards.

What you want is full coverage, as thin as possible.

 

Hi,
https://www.youtube.com/watch?time_continue=1&v=EyXLu1Ms-q4

 

You need not push it to the extreme edges. Keep a bit of space around the edges for the paste to spread.
Also, keep the layer thin to avoid too much squishing.

Alternatively, you could try out the 'X' method. It seems to work quite well with Ryzen 3xxx CPUs.

Lastly, Unless you're using a conductive paste, you don't have to worry about it going over the sides.

 

if i use x method or 2 line methods how wide should i make the line?like 1/4th inch thick or what? thanks

 

Hi,
X clearly works best
From the center of the chip just go past about 1/2" with still pea size in center.
That should cover the entire chip.

 

Amd_robert from the official amd reddit recommends a X so that’s what I used and works fine.


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I like to spared it out with edge of business card = LMAO as it has never failed me = Antec Silver Formula = Super Glue with in 30 sec as it will rip the cpu out of socket without cure time or release being used = 100% bonded

 

This is how it spreads out using an X of thermal paste applied. My AIO has a dip in the corner but the rest is good and flat.

 

Credit card spread method.

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Credit card spread method.

PERFECTION :thumb: .

 

I dont have any pics, But I researched the location of the chiplets and I/O die using derbaurs delid video, and applied a dab of paste on each chiplet location and a small vertical line on the I/O die location.

 

Wendell from Level1Techs recommends pea size dots of Thermal Paste on each chiplet locations. I haven't test it but spread method works well with TIM with low viscosity like MX-4 for example.

 

I Tried a 3 dot method via suggested by Level1Techs in the video below to see what would happen. I dropped approx 8c over regular peadot method in the middle however this also could be due to from the fan not being on in the rear of my Noctua U12A hard to tell unless i physically open my side panel and touch to see if the fan is on. However that being said on Average ryzen Master would show im at 60c while gaming World of Warcraft but after new application consistant 51c-52c.

https://imgur.com/a/hseMmWF