I've lapped a cpu in the past and will probably lap my cpu die unless I get the rockit kit thing with the bigger pre lapped die but
I saw a YouTube video of someone delidding a 9900k then he scraped off the solder interface, then he lapped the actual silicon on the chip, and I'm wondering how that could possibly be safe. He claimed to get like something like 15C cooler off of it. He removed like a quarter of the silicon on the chip
What I'm wondering is would this be detrimental to the cpu in ways you can't really notice with a stress test? Why would Intel make the chip way thicker than normal? Apparently the thermal conductivity of silicon is much lower than copper and the claim was that going through that fraction of a millimeter of the chip is the main reason why Temps can't be controlled on the 9900k even with the best aio there is. Personally I hate aio coolers and tried one and a 240 rad won't even bolt to my spec 02 case so I'm gunna get a dark rock pro 4 or a noctua d15 chromax. By the way are those perfectly flat and true on the bottom or should they be lapped too?
I'm 100 percent going to have a lapped cpu even to get 2C out of itbecause that makes the noctua keep up with the best watercooling there is even though I know the reason people lap is for liquid nitrogen and the fact it cracks the thermal compound from convexing
But yeah is it worth it to rip my IHS off my cpu, then scrape off the solder then sand a quarter of the silicon off my chip? I wanna overclock my 9900k and it's stock for now til I pick my best thermal solution but it seems like even the best coolers in the world can end up near 100c on these chips and honestly short of trading my Intel mobo and cpu for an AMD thatcan be tamed I don't know what to do about this
Edit: I read up somewhere on reddit and someone was talking about the equation of thermal conductivity of the chip and claimed the cpu would have to produce something like a 900 watt TDP to even have that little bit of silicon sanded down matter to drop the Temps 15C, if that's the case would delidding and liquid metal work almost as s good as sanding the chip?
I saw a YouTube video of someone delidding a 9900k then he scraped off the solder interface, then he lapped the actual silicon on the chip, and I'm wondering how that could possibly be safe. He claimed to get like something like 15C cooler off of it. He removed like a quarter of the silicon on the chip
What I'm wondering is would this be detrimental to the cpu in ways you can't really notice with a stress test? Why would Intel make the chip way thicker than normal? Apparently the thermal conductivity of silicon is much lower than copper and the claim was that going through that fraction of a millimeter of the chip is the main reason why Temps can't be controlled on the 9900k even with the best aio there is. Personally I hate aio coolers and tried one and a 240 rad won't even bolt to my spec 02 case so I'm gunna get a dark rock pro 4 or a noctua d15 chromax. By the way are those perfectly flat and true on the bottom or should they be lapped too?
I'm 100 percent going to have a lapped cpu even to get 2C out of itbecause that makes the noctua keep up with the best watercooling there is even though I know the reason people lap is for liquid nitrogen and the fact it cracks the thermal compound from convexing
But yeah is it worth it to rip my IHS off my cpu, then scrape off the solder then sand a quarter of the silicon off my chip? I wanna overclock my 9900k and it's stock for now til I pick my best thermal solution but it seems like even the best coolers in the world can end up near 100c on these chips and honestly short of trading my Intel mobo and cpu for an AMD thatcan be tamed I don't know what to do about this
Edit: I read up somewhere on reddit and someone was talking about the equation of thermal conductivity of the chip and claimed the cpu would have to produce something like a 900 watt TDP to even have that little bit of silicon sanded down matter to drop the Temps 15C, if that's the case would delidding and liquid metal work almost as s good as sanding the chip?